Stock code 002514
Stock code 002514
Used for etching, PSG / BSG removal, cleaning and drying of single and polycrystalline silicon wafers.
Equipment performance
Adjustable transmission speed: 0.5-3m/min
Normal operation speed: 2.5m/min
Capacity: up to 4000 wafers/ H@20mm
Up to 6800 Wafers/ H@20mm
Up to 8000 Wafers/ H@20mm
Effective utilization rate of equipment: ≥ 98%
Etching depth range: 0.7 ~ 6 μ m
Fragment rate: ≤ 0.03%
Silicon wafer specification
Silicon wafer thickness: ≥ 140 μ m
Silicon wafer size: 156.75 * 156.75mm-212 * 212mm
transmission
Transmission type: 5 lane / 6 Lane
Shaft spacing: 50mm / 60mm
Main drive shaft: 17mm, hexagon
Drive roller: Φ 32mm
direction
Working direction：Left→Right/ Right→Left（TBD）
power supply
Power supply: AC380V 3Ph + PE + n 50Hz (TBD)
Control power supply: DC 24V
Full load power supply: 75A
Recommended maximum fuse size: 100A
Installation requirements
Minimum ground bearing capacity: 75kg / ㎡
Minimum workshop height: 3.5m
Clean room level: iso7 (10K class)
Ambient temperature: 17 ℃＜ RT ＜ 30 ℃
Maximum humidity: 70%